general specifications surface mount terminations 30 watts, 50 model RFP-375375-6Z50-2 resistive element: thick film substrate: beryllium oxide ceramic t erminals: thick film silver outline drawing .375 .375 .148 .080 .060 .105 .045 .148 .080 rfp 375375 6zxxx bottom view side view top view hatched area indicates location of protective coating notes: t olerance is .010, unless otherwise specified. operating temperature is -55? to +125? (see chart). designed to meet or exceed applicable portions of mil-e-5400. all dimensions are in inches. specifications subject to change without notice. electrical specifications resistance value: 50 ohms, 2% frequency range: dc - 3.0 ghz power: 30 watts v .s.w.r.: 1.20:1 surface mount terminations features dc - 3.0 ghz 30 watts beo ceramic non-nichrome resistive element low vswr 100% tested ? 1 sales desk usa: v oice: (800) 544-2414 fax: (315) 432-9121 sales desk europe: v oice: (+44) 23 92 232392 fax: (+44) 23 92 251369 a vailable on tape and reel for pick and place manufacturing. note: xxx denotes value. ver. 12/5/01
125 100 75 50 100 75 50 25 0 25 % of rated power p.c.b. solder interface temperature c surface mount terminations model RFP-375375-6Z50-2 t ypical performance 2 sales desk usa: v oice: (800) 544-2414 fax: (315) 432-9121 sales desk europe: v oice: (+44) 23 92 232392 fax: (+44) 23 92 251369 power derating suggested mounting procedures a vailable on tape and reel for pick and place manufacturing. (2 pls.) screw solder paste pc board heatsink solder filled via 1. solder part in place using 60/40 type solder with controlled temperature iron (700?). 2. drill thermal vias through pcb and fill with solder, such as 60/40 type. 3. to ensure good thermal connectivity to heat sink, drill and tap heatsink and mount pcb board to heat sink using screws.
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